GOKU F722 Pro V2 55A 32Bit AM32 128K 30X30 Stack / FC / ESC

$49.99 – $99.99

A powerful stack by Flywoo featuring Flywoo GOKU F722 FC, 55A 6S BL32 / AM32 4-in-1 ESCThis stack can handle 6S input voltage and will push your FPV quad/s to the max!

Free Shipping

GOKU F722 Pro V2 55A 32Bit 128K 30X30 Stack

The new generation F722 PRO V2 flight controller from FLYWOO not only offers a standard 30.5mm size, high-performance STM32 F722 main control, and ICM42688 gyroscope, but it also supports 8 motor outputs and reserves dual 4-in-1 ESC sockets.

It features a user-friendly socket design for all ports, which significantly simplifies the process of connecting devices, thereby enhancing installation efficiency and making maintenance and fault inspection more convenient. This design effectively lowers the threshold for building drones.

Moreover, all solder pads are retained, providing customers with the flexibility to choose their preferred method of device connection.

Furthermore, it includes a plug-and-play feature, specifically designed for the DJI O3 Air Unit, which streamlines the integration process for pilots looking to utilize DJI’s advanced digital transmission system with their builds.

Highlights：

High-performance processor: Equipped with the STM32F722 high-performance processor with a processing speed of up to 216MHz for faster response.
Precision gyroscope: Features the ICM42688 gyroscope for improved control precision and enhanced flight stability.
Modular installation: Utilizes snap-lock sockets for plug-and-play functionality without the need for soldering, enabling modular installation, and includes reserved solder pads.
Large-capacity black box: Includes a 16MB large-capacity black box to ensure sufficient storage of flight data for later analysis.
Stable current output: Onboard 10V/3A and 5V/3A BEC to provide stable current output for VTX and various peripherals.
Multiple motor outputs: Supports 8 motor outputs and reserves dual 4-in-1 ESC sockets for simplified connections.
Durable design: Utilizes immersion gold PCB manufacturing process to ensure high-temperature and high-current resistance, guaranteeing stable operation.